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2010 COMPUTEX TAIPEI
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ChipSiP Technology Co., Ltd
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 Show all products |
 Product |
DSC&Communication Module MCP(M-NOR Flash+M-SDRAM)
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| Model Name |
CT72
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| Price |
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| Description |
CT72 series combine M-NOR Flash and M-SDRAM into one package for minimizing board size. The detail density is as followings.
32Mb NOR(Multi-Bank,Top Boot)+64Mb M-SDRAM 8x10x1.2mm dimension, FBGA package.
64Mb NOR(Multi-Bank,Top Boot)+64Mb M-SDRAM 8x10x1.2mm dimension, FBGA package.
128Mb NOR(Multi-Bank,Top Boot)+128Mb M-DDR SDRAM 8x10x1.2mm dimension, FBGA package.
Other combination and SiP ODM are available upon request.
Applications
Communication Module, Mobile Phone, Smart Phone and so on.
Advantages
Minimize PCB size with lower BOM cost.
High performance; EMI noise reduction.
Diversify densities to meet market demand.
Customization to fulfill unique request.
Strong wafer resources to ensure stable supply.
Standard package & technical support for time-to-market design.
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